Rajeev Chandrasekha: Assam will receive ₹25,000 crore for semiconductor packing facility
A financial aid package of ₹76,000 crore has been set aside by the government to entice semiconductor production and packaging businesses to establish themselves in the country.
According to Rajeev Chandrasekhar, the minister of state for electronics and IT, Assam will soon have a ₹25,000 crore semiconductor packaging facility that will be built in collaboration with the state government and Tata Group. He made this announcement on Thursday at the Future Skills Summit in Guwahati.
“Tata Group and the Assam government will collaborate to develop a semiconductor packaging factory. We’ll get all the permissions in due course and present it to the cabinet for final approval.
The minister stated at the occasion that young Indians who want to work in the semiconductor industry won’t need to leave their state or move to other places.
The declaration from the ministry comes after Chief ministry Himanta Biswa Sarma had previously announced the arrival of a packaging plant in the state.
A financial aid package of ₹76,000 crore has been set aside by the government to entice semiconductor production and packaging businesses to establish themselves in the nation. Micron Technology, a US-based company, made the first investment under the plan and started establishing its ATMP facility in Sanand, Gujarat. The factory will require a $2.75 billion investment, of which Micron would provide $800 million and the federal and state governments the remaining portion. By December 2024, the plant is planned to produce its first packaged chip.
Authorities from the federal government state that the Tata Group would be qualified for the subsidies if and when they apply.
The Indian government is inviting bids for a $10 billion financial aid package to establish semiconductor fabrication units and related services. The government has approved US-based Micron Technology Inc.’s plans to build a testing and packaging facility in Gujarat, and the facility is now being built up.
The government has received 13 offers for chip assembly units and 4 proposals for semiconductor manufacturing plants, as Chandrasekhar previously reported.
In reference to future skills, the minister said that the government wants to convey that numerous opportunities will arise for students in the next years due to government initiatives. “Students need to arm themselves with knowledge in areas such as cybersecurity, artificial intelligence, and semiconductors. Today, Guwahati is home to the biggest companies in these sectors worldwide, including NVIDIA, AMD, Intel, HCL, Wipro, and IBM. They all convey the same idea, which is that there are several employment alternatives available, but obtaining the requisite skills is essential,” he said.
The Minister confirmed that India is well-positioned to take the lead in determining the direction of technology through programs like futureSKILLS. This initiative would create an internationally competitive talent pool that is available to organizations globally as well as Indian firms, therefore creating a new benchmark in the global IT industry.